Henkel Ramps Up Entry into the 3D Printing Industry

Henkel Ramps Up Entry into the 3D Printing Industry

New solutions for 3D Printing For global German manufacturer Henkel, it’s a short leap from their light curing acrylic, epoxy, polyurethane and hotmelt adhesives to additive manufacturing (3D printing). The materials have already been adapted for use in the medical device, automotive and electronics industries. Henkel is in the process of taking the next step…

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Wacker’s New SEMICOSIL® 811 Rubber Silicone – Short curing times, fast adhesion

Wacker’s New SEMICOSIL® 811 Rubber Silicone – Short curing times, fast adhesion

Semicosil 811 – Less is better Wacker’s come out with a new adhesive, Semicosil, 811, to shorten your curing times and create adhesive bonding to substrates with very little energy. The result—less processing time and shorter cycles. Additionally, the new formula can be used on heat-sensitive substrates. Semicosil 811 will completely cure at room temperature…

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Voila! From This to That – Adhesive Recycling Program

Voila! From This to That – Adhesive Recycling Program

Fill the Box Instead of the Landfill You thought it couldn’t be done. Now it can. Henkel has partnered with TerraCycle to launch an Adhesive Recycling Program that gives you the opportunity to put your empty LOCTITE anaerobic adhesive packaging to good use by recycling them. LOCTITE products offer viable alternatives to mechanical fastening and joining methods. How…

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Finally – Thermal Control During the PCB Encapsulating Process

Finally – Thermal Control During the PCB Encapsulating Process

Keep cool–the heat’s off with Henkel’s latest Technomelt TC 50 formulation Everybody innovates–all the time–and sometimes somebody really hits the mark. This time Henkel tackles and conquers the ability to thermally control heat during encapsulation of electronic assemblies with their latest formulation Technomelt (TC 50) material. Encapsulating PCBs can be a big problem. Overheating during…

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